 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| FPF1003 IntelliMAXTM Advanced Load Management Products July 2006 FPF1003 IntelliMAXTM Advanced Load Management Products Features 1.2 to 5.5V Input Voltage Range RDS(ON) = 30 m @ VIN = 5.5V RDS(ON) = 35 m @ VIN = 3.3V ESD Protected, above 2000V HBM tm General Description The FPF1003 is a low RDS P-Channel MOSFET load switch with controlled turn-on. The input voltage range operates from 1.2V to 5.5V to fulfill today's Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. FPF1003 is available in a space-saving 1.0x1.5 mm2 chip scale package, 1.0X1.5CSP-6. Applications PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies Pin 1 VIN VIN ON GND VOUT VOUT BOTTOM TOP Typical Application Circuit TO LOAD VIN VOUT FPF1003 OFF ON ON GND Ordering Information Part FPF1003 Switch 30m, PMOS Input buffer Schmitt Output Discharge NA ON Pin Activity Active HI Top Mark 3 (c)2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FPF1003 Rev.G FPF1003 IntelliMAXTM Advanced Load Management Products Functional Block Diagram VIN Turn-On Slew Controlled Driver CONTROL LOGIC ON VOUT GND Pin Configuration A2 A1 B2 B1 C2 C1 1.0 x 1.5 CSP Bottom View Pin Description Pin A2, B2 C2 A1, B1 C1 Name VIN ON VOUT GND ON Control Input Function Supply Input: Input to the power switch and the supply voltage for the IC Switch Output: Output of the power switch Ground FPF1003 Rev. G 2 www.fairchildsemi.com FPF1003 IntelliMAXTM Advanced Load Management Products Absolute Maximum Ratings Parameter VIN, VOUT, to GND Power Dissipation @ TA = 25C Maximum Continuous Switch Current Operating Temperature Range Storage Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM MM 2000 200 -40 -65 Min. -0.3 Max. 6 1.2 2.0 125 150 85 Unit V W A C C C/W V V Recommended Operating Range Parameter VIN Ambient Operating Temperature, TA Min. 1.2 -40 Max. 5.5 85 Unit V C Electrical Characteristics VIN = 1.2 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C. Parameter Basic Operation Operating Voltage Quiescent Current Off Supply Current Off Switch Current On-Resistance Symbol VIN IQ IQ(off) ISD(off) RON Conditions Min. 1.2 Typ. Max 5.5 1 1 1 Units V A A A m IOUT = 0mA, VIN = Von Von = GND, OUT = open Von = GND, VOUT= 0 VIN = 5.5V, TA = 25C VIN = 3.3V, TA = 25C VIN = 1.5V, TA = 25C VIN = 1.2V, TA = 25C 20 25 50 95 2 0.8 30 35 75 150 ON Input Logic High Voltage ON Input Logic Low Voltage ON Input Leakage Dynamic Turn on delay Turn off delay VOUT Rise Time VOUT Fall Time VIH VIL VIN = 2.7V to 5.5V VIN = 1.2V VIN = 2.7V to 5.5V VIN = 1.2V VON = VIN or GND V 0.8 0.35 1 13 45 13 113 A s s s s V tON tOFF tR tF VIN = 3.3V, RL=500, CL=0.1uF, TA = 25C VIN = 3.3V, RL=500, CL=0.1uF, TA = 25C VIN = 3.3V, RL=500, CL=0.1uF, TA = 25C VIN = 3.3V, RL=500, CL=0.1uF, TA = 25C FPF1003 Rev. G 3 www.fairchildsemi.com FPF1003 IntelliMAXTM Advanced Load Management Products Typical Characteristics 10 2 8 SUPPLY CURRENT (nA) 6 ON THRESHOLD (V) VON = 0V 1.5 1 4 VON = VIN 0.5 2 0 1 2 3 4 5 6 7 SUPPLY VOLTAGE (V) 8 9 10 0 1 2 3 4 SUPPLY VOLTAGE (V) 5 6 Figure 1. Quiescent Current vs.VIN Figure 2. ON Threshold vs. VIN 16 14 SUPPLY CURRENT (nA) SUPPLY CURRENT (nA) 12 10 8 6 4 2 0 -40 VIN = 5.5V 10 8 6 VIN = 5.5V 4 2 VIN = 3.3V VIN = 3.3V -15 10 35 60 TJ, JUNCTION TEMPERATURE (oC) 85 0 -40 -15 10 35 60 TJ, JUNCTION TEMPERATURE (oC) 85 Figure 3. Quiescent Current vs. Temperature Figure 4. Quiescent Current (off) vs. Temperature 1600 1400 SUPPLY CURRENT (nA) 1200 1000 800 600 400 200 0 -50 VIN = 3.3V 160 140 SUPPLY CURRENT (nA) 120 100 80 60 40 20 0 -25 0 25 50 o TJ, JUNCTION TEMPERATURE ( C) 75 100 VIN = 5.5V 1 2 3 4 SUPPLY VOLTAGE (V) 5 6 Figure 5. ISWITCH-OFF Current vs. Temperature Figure 6. ISWITCH-OFF Current vs. VIN FPF1003 Rev. G 4 www.fairchildsemi.com FPF1003 IntelliMAXTM Advanced Load Management Products Typical Characteristics 250 IOUT = 1A 1.5 VIN = 3.3V IOUT = 1A ON RESISTANCE (mOhms) RON NORMALIZED, (mOhms) 200 1.3 150 1.1 100 0.9 50 0.7 0 0 1 2 3 4 SUPPLY VOLTAGE (V) 5 6 7 0.5 -50 -25 0 25 50 TJ, JUNCTION TEMPERATURE (oC) 75 100 Figure 7. RON vs. VIN Figure 8. RON vs. Temperature 100 1000 VIN = 3.3V RL = 500 CL = 0.1uF VIN = 3.3V RL = 500 CL = 0.1uF TURN ON/OFF TIME (uS) RISE / FALL TIME (uS) TOFF 100 TFALL TRISE 10 TON 10 -50 -25 0 25 50 75 TJ, JUNCTION TEMPERATURE ( oC) 100 1 -50 -25 0 25 50 75 o TJ, JUNCTION TEMPERATURE ( C) 100 Figure 9. TON/TOff vs. Temperature Figure 10. TRISE/TFALL vs. Temperature CIN=1uF COUT=0.1uF VON 2V/DIV RLOAD=500 VON 2V/DIV CIN=1uF COUT=0.1uF RLOAD=500 IOUT 10mA/DIV IOUT 10mA/DIV VOUT 2V/DIV VOUT 2V/DIV 50us/DIV Figure 11. TON Response 5 50us/DIV Figure 12. TOFF Response FPF1003 Rev. G www.fairchildsemi.com FPF1003 IntelliMAXTM Advanced Load Management Products Typical Characteristics CIN=1uF COUT=0.1uF VON 2V/DIV RLOAD=10 VON 2V/DIV CIN=1uF COUT=0.1uF RLOAD=10 IOUT 200mA/DIV IOUT 200mA/DIV VOUT 2V/DIV VOUT 2V/DIV 50us/DIV Figure 13. TON Response 2us/DIV Figure 14. TOFF Response FPF1003 Rev. G 6 www.fairchildsemi.com FPF1003 IntelliMAXTM Advanced Load Management Products Description of Operation The FPF1003 is a low RDS(ON) P-Channel load switch with controlled turn-on. The core of each device is a 30m P-Channel MOSFET and a controller capable of functioning over a wide input operating range of 1.2-5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. Application Information Typical Application TO LOAD VIN Battery 1.2V-5.5V VOUT FPF1003 OFF ON C1 = 1F ON GND C2 = 0.1F R1 = 499 Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1F ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. Output Capacitor A 0.1F capacitor, COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductance from forcing VOUT below GND when the switch turns-off. Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. FPF1003 Rev. G 7 www.fairchildsemi.com FPF1003 IntelliMAXTM Advanced Load Management Products Dimensional Outline and Pad Layout 1 .0 0 .1 0 IN D E X SLO T OUT 1 A 2 IN 0 .5 0 1 .5 0 0 .1 0 O 0 .2 5 B C GND ON 0 .5 0 RECOMMENDED LAND PATTERN 1 .0 0 T O P V IE W 0 .6 5 M A X O 0 .3 0 2 A 1 IN D E X SLO T 0 .5 0 0 .2 8 0 .2 2 S ID E V IE W SO LDER BALL B C 1 .0 0 0 .5 0 B O T T O M V IE W NOTES: A ) A L L D IM E N S IO N S A R E IN M IL L IM E T E R S . FPF1003 Rev. G 8 www.fairchildsemi.com FPF1003 IntelliMAXTM Advanced Load Management Products TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM FPSTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyBoostTM TinyBuckTM TinyPWMTM TinyPowerTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UniFETTM UltraFET(R) VCXTM WireTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. DISCLAIMER FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. LIFE SUPPORT POLICY PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I20 Preliminary No Identification Needed Full Production Obsolete Not In Production FPF1003 Rev. G 9 www.fairchildsemi.com |
Price & Availability of FPF1003
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |